Slurry pressure distribution, resultant forces and moments acting on the wafer are calculated in typical conditions of the wafer polishing, and then nominal clearance of the slurry film, roll and pitch angles at the steady state are obtained. 在标准研磨条件下计算出了抛光液压力分布,同时得到了抛光液膜厚、转角以及倾角的稳定状态。